Nikko-Materials is a dynamic enterprise in which unique manufacturing and engineering departments produce characteristic products. It is a company that makes great progress while providing the printed circuit board industry with the most advanced products.
Vacuum Lamination―Laminating film type material in vacuum environment―is the most suitable material application method for today’s microfabrication of devices.
Nikko-Materials is the leading solution provider of Lamination Technology for more than 20 years in electronics industry, and always will be.
Our R&D and field application engineering team will be by your side and make your lamination process a big success.
Injecting compressed air into rubber balloon(Diaphragm) and its expansion presses material. Its pressure is mild and good at handling fragile materials(e.g. wafer). It is also good at laminating thin films on fine and narrow patterns.
Rubber Press Lamination
Rubber Press Lamination is powered by hydraulic power.
The high-power rubber press laminator is good at laminating rigid resin into fine Patterns.
Lamination is not enough to achieve enough planarity requirement.
On CVP series, we have flattening stage. It flattens material with specular-finished SUS Plate.
Automated Line/Carrier Film Conveyance System
In CV-series, substrate will be carried by Carrier Film conveyance system.Together with Pre-tacking Machine NT, it can fully automate lamination process.