CVP-300 |
|
Equipment Feature: Equipment Structure: Lamination Method: Diaphragm Footprint: (L) 4135mm x (w)3180mm x (h)1935mm Acceptable Worksize: MAX510 x 610(mm) Utilities: |
Vacuum Lamination―Laminating film type material in vacuum environment―is the most suitable material application method for today’s microfabrication of devices.
Nikko-Materials is the leading solution provider of Lamination Technology for more than 20 years in electronics industry, and always will be.
Our R&D and field application engineering team will be by your side and make your lamination process a big success.
CVP-300 |
|
Equipment Feature: Equipment Structure: Lamination Method: Diaphragm Footprint: (L) 4135mm x (w)3180mm x (h)1935mm Acceptable Worksize: MAX510 x 610(mm) Utilities: |