Equipment Feature:
CV-300T is down-sized model of CV-300, which is specially designed for wafer and Small substrate. It is also capable of conveying extremely thin wafer with dicing frame.

Equipment Structure:
-Carrier Film Conveyance System(Film Forwarder/ Film Rewinder)
-Lamination Chamber
-Lamination Method(Diaphragm)

Lamination Method: Diaphragm

Footprint: (L)3717mm x (w) 2530mm x (h)2120mm

Acceptable Worksize: MAX350 x 350(mm)

Utilities:
Compressed Air: 0.5~0.6MPa
Forced Exhaust
3-Phase AC 220V
Cooling water for Vacuum Pump: 2~3L/min